Medical Laser jobs

The Centre for Heterogeneous Integration and Production

The Centre for Heterogeneous Integration and Production (CHIP) is a newly established InnoHK research centre led by The Chinese University of Hong Kong, in collaboration with the National University of Singapore, under the SEAM@InnoHK research cluster. Supported by the Innovation and Technology Commission of the HKSAR Government, CHIP focuses on advancing next‑generation semiconductor manufacturing, heterogeneous integration technologies and advanced electronic materials, addressing critical challenges beyond Moore’s Law and enabling applications in AI, high‑performance computing, robotics and related fields.

The Engineer is expected to collaborate with the research team to drive project goals for Center’s Research Programme.

Key Responsibilities

• Precision Manufacturing & Equipment: Develop and optimise key technologies for semiconductor precision manufacturing and metrology, including high-speed, high-resolution UV direct writing equipment, wafer bonding systems, 2D lithography platforms, and laser etching tools, to enhance the speed, precision, and scalability of 3D and electronic ICs.
• Materials Engineering & Advanced Packaging: Conduct research in foundational materials and advanced packaging solutions. This includes developing bonding technologies, pioneering chip-interface thermal management, and preparing 2D emerging semiconductor materials for industrial-scale heterogeneous integration.
• Novel Devices & Systems: Support the development of heterogeneously integrated devices and systems, such as electronic-photonic integrated circuits, BEOL-compatible devices, 2D material-silicon (Si) hybrid optoelectronic chips, and flexible sensor modules.
• R&D Execution: Draft technical documentation, patents, and research papers. Collaborate closely with cross-functional teams from CUHK, NUS, and industry partners to translate research concepts into viable technological solutions

Job Requirement

• Ph.D. in in Microelectronics, Electronic Engineering, Mechanical Engineering, Optical Engineering, Materials Science, Applied Physics, or closely related discipline.
• 3+ years of progressive engineering experience in industry.
• Strong background in optical system design, optical alignment, or the R&D of precision optical instruments is highly preferred.
• Hands-on experience in semiconductor nanofabrication (lithography, etching, thin-film deposition), advanced packaging (2.5D/3D, Chiplets), or optoelectronic device integration.
• Proficiency in cleanroom operations and semiconductor characterization/metrology equipment.
• Prior experience with 2D materials, thermal management engineering, or wafer bonding processes is also a strong plus.
• Strong analytical and problem-solving skills with an innovative mindset. Ability to work effectively in a fast-paced R&D environment.
• Excellent command of both written and spoken English and Chinese.
• Applicants with less experience will be considered as Assistant Engineer

We offer 5-day work, attractive remuneration package to the successful candidate. The appointment will be on renewable contract terms, renewal is subject to satisfactory performance and mutual agreement. If you meet the above requirements and are interested in this opportunity, please submit your resume with your expected salary and availability for our consideration.

We are an equal opportunity employer. All information provided by applicants will be treated in strict confidence and used for recruitment purpose only.

Benefits:

• Dental insurance
• Medical Insurance

Work Location: In person